PCB  Capabilities

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Item

Lot Size

Normal

Special

Remark

PCB(used for SMT)spec

(L*W)

Min

L≥50mm
W≥50mm

L50mm

Includes the Process Edge

Max

L≤460mm
W≤400mm

L 460mm
W 400mm

(T)

Min thickness

0.5mm

T0.5mm

Max thickness

4.5mm

T4.5mm

SMT components spec

outline dimension

Min size

0201
(0.6mm*0.3mm)

01005
0.3mm*0.2mm)

/

Max size

200mm*125mm

200mm*125mmSMD

/

component thickness

T≤6.5mm

6.5mmT≤15mm

/

QFPSOPSOJ(multi pins)

Min pin space

0.4mm

0.3mm≤Pitch0.4mm

/

CSP,BGA

Min ball space

0.5mm

0.3mm≤Pitch0.5mm

/



Item

Prototype Manufacturer

Normal

Special

Remark

SMT PCB SPEC

(L*W)

Min size

L≥50mm
W≥30mm

L50mm

Includes the Process Edge

Max size

L≤450mm
W≤350mm

L800-450mm
W400-350mm

(T)

Minimum thickness

0.8mm

T0.8mm

Maximum Thickness

2mm

T2mm

DIP PCB SPEC

(L*W)

Min Size

L≥50mm
W≥30mm

L50mm

Max Size

L≤500mm
W≤300mm

L≥500mm
W≥300mm

(T)

Minimum Thickness

0.8mm

T0.8mm

Maximum Thickness

2mm

T2mm







Item

Parameter

Max Design Layer

100L

Min Trace Width / Space

Inner Layer

2mil

Out Layer

2mil

Min Hole Diameter

CNC

6mil

Laser

4mil

Max PIN Quantity in a Board

50000PIN

Max BGA Quantity in a Board

30PCS

Min Space Between two BGA

0.35mm

Max Signal

40Gbps

Product Type

Data Communication Products

ATCAAMCCPCIPCIE

Optical Network Products

SDH/DWDMLMDSGSM/GPRS

Multimedia Products

Video Telephone, Conference TV, Monitoring Equipment, etc.

Computer Product

MBNBSERVER main board

Aerospace Products

Satellite Navigation, Flight Control System, Communication Positioning System

Industry Control Product

ARMDSPX86

Consumer Product

Smart Home Appliances, Smart Phones, Smart Clothes, etc.